IEC 60352-5 provides a comprehensive standard for solderless connections used in surface mount technology. The standard outlines the requirements for the design, testing, and inspection of solderless connections, ensuring their reliability and performance. The benefits of solderless connections, including increased reliability, improved manufacturing efficiency, and enhanced flexibility, make them suitable for a wide range of applications. As the demand for miniaturization and high-density mounting continues to grow, the use of solderless connections as specified in IEC 60352-5 is expected to become increasingly popular.
Unless the component specification says otherwise, testing must be performed on . The test‑board thickness must match the designed thickness of the press‑in connection in the end product. If the press‑fit design is intended for different board thicknesses, the test must be performed using the thinnest nominal thickness that the press‑fit will encounter, because that represents the worst‑case mechanical condition.
As of now, the 2015 version is the latest national adoption, although it is based on the 2008 IEC edition. It is important to note that a Chinese version of the newer 2020 IEC edition does not yet have a corresponding GB/T number.
Many European countries adopt the IEC standard as a "EN" (European Norm) and then as a national standard. The technical content is identical, but the title and number change. iec 60352-5 pdf
IEC 60352-5 is part of the broader IEC 60352 series, which deals with solderless connections. Specifically, Part 5 focuses on (also known as "压入式连接" in Chinese). The standard establishes the general requirements, test methods, and practical guidance for such connections.
Sensitive surface-mount components nearby are not subjected to the intense heat of soldering ovens.
The IEC 60352 series consists of several parts, each devoted to a different solderless connection technology. Understanding the differences helps you select the correct standard for your application. IEC 60352-5 provides a comprehensive standard for solderless
is the primary international standard for solderless press-in connections . It provides the essential framework for ensuring that these mechanical connections—often used in place of traditional soldering—remain electrically stable and mechanically sound throughout the lifespan of an electronic device. Overview of IEC 60352-5
A press-fit connection is established by pressing a specially designed elastic or rigid pin into a plated through-hole (PTH) of a printed circuit board (PCB). The friction and deformation between the pin and the hole create a gas-tight, highly stable electrical and mechanical joint without the use of heat or solder alloy. The standard establishes clear boundaries for:
The standard covers board thickness, hole diameter and plating, the permissible press‑in and push‑out forces, contact resistance measurements, climatic ageing, vibration, and many other environmental influences. The latest edition (see below) expands the scope from telecommunication equipment to all kinds of electrical and electronic equipment and components. As the demand for miniaturization and high-density mounting
The force required to extract the pin must remain high enough to ensure the connection does not back out under vibration or thermal shock. 3. Electrical Requirements
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The reliability of a press-fit connection depends entirely on the interference fit between the pin and the hole. The standard dictates strict tolerances for:
A typical test sequence per IEC 60352-5 for automotive use (severe conditions):
